NOTE: This disposition is nonprecedential. United States Court of Appeals
for the Federal Circuit
DANIEL L. FLAMM,
Appellant
v.
MICRON TECHNOLOGY, INC., INTEL
CORPORATION, GLOBALFOUNDRIES U.S., INC.,
SAMSUNG ELECTRONICS COMPANY, LTD.,
Appellees
2018-2322
Appeal from the United States Patent and Trademark Office, Patent Trial and Appeal Board in Nos. IPR2017-00391, IPR2017-01746.
JUDGMENT
ROLF STADHEIM, Stadheim & Grear, Scottsdale, AZ, argued for appellant. MELANIE L. BOSTWICK, Orrick, Herrington & Sutcliffe LLP, Washington, DC, argued for appellees Micron Technology, Inc., Intel Corporation, GLOBALFOUNDRIES U.S., Inc. Appellee Micron Technology, Inc. also represented by JARED BOBROW, JEREMY JASON LANG, Menlo
2Park, CA. CHAD S. CAMPBELL, Perkins Coie LLP, Phoenix, AZ, for appellee Intel Corporation. Also represented by TYLER R. BOWEN; DAN L. BAGATELL, Hanover, NH; PHILIP ALCIDE MORIN, San Diego, CA; JONATHAN L. MCFARLAND, Seattle, WA.
SHAMITA ETIENNE-CUMMINGS, White & Case LLP, Washington, DC, for appellee GLOBALFOUNDRIES U.S., Inc. Also represented by DAVID TENNANT. NAVEEN MODI, Paul Hastings LLP, Washington, DC, for appellee Samsung Electronics Company, Ltd.
THIS CAUSE having been heard and considered, it is ORDERED and ADJUDGED:
STOLL, Circuit Judges).
AFFIRMED. See Fed. Cir. R. 36.
ENTERED BY ORDER OF THE COURT
September 6, 2019 /s /Peter R. Marksteiner Date Peter R. Marksteiner Clerk of Court